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With our modern high mix production facilities, Crescentech is able to respond quickly to changes in the working environment, allowing us to gain more production and maintain high levels of quality. We have won praises from customers for achieving on-time delivery every time, fast response time, and adding value to our customers’ total competitiveness.

We possess and provide:

  • Robust SMT system process capable of 0.3mm(lead pitch), 0.5mm(ball pitch-BGAs) and component size range  0402mm ~¡¼55mm QFP, BGA
  • Mixed SMT and through-hole technology
  • Hybrid production model option for cost optimization
  • Lead free process assembly
  • Solder assembly standards defined by IPC-A-610 Class II
    • Clean and No-clean assembly process
    • Cleanliness as defined by IPC-CH-65 guidelines
  • Custom board-level test design and execution
  • System level test
  • BGA rework and re-balling
  • Full Turnkey Project Management
  • Fast turnaround and delivery